Bisphenol A allyl ether is an organic compound with the chemical formula C21H24O2. It is a colorless or light yellow liquid and an important intermediate in organic synthesis. It is mainly used as a crosslinking agent for epoxy resins. Used for high-end application technologies, including adhesives on semiconductor chip surfaces, photoresist materials, impact resistant prepreg blanks, forming of fiber-reinforced structural components, mixed materials for high-temperature and chemical corrosion resistance, high-temperature coating, waterproofing, corrosion resistance, and other functions.

Chinese name Bisphenol A Diallyl Ether

Foreign name: Bisphenol A diallyl ether

Chemical formula: C21H24O2

Molecular weight: 308.4140

CAS login number: 3739-67-1

EINECS login number: 223-123-3

Boiling point: 430.5 ℃ (at 760 mmHg)

Density: 1.043 g/cm ³

Appearance: Colorless or light yellow liquid

Under high temperature, Cleasen rearrangement can occur to form diallyl bisphenol A. Diallyl bisphenol A is mainly used for the modification of bismaleimide resin (BMI), which can significantly reduce the application cost of BMI resin, improve the operability and processability of BMI resin.

Bisphenol A diallyl ether is applied in high-end application technologies, including adhesives on semiconductor chip surfaces, photoresist materials, impact resistant prepreg blanks, forming of fiber-reinforced structural components, mixed materials for high-temperature and chemical corrosion resistance, high-temperature coating, waterproofing, corrosion resistance, and other functions.